15.6Inch single side multi-segment FOB / FOB constant temperature bonding machine OL-F156

1.1 This equipment is a semi-automatic hot press bonding machine. It is a device for bonding the FPC to the Panel on which the conductive film (ACF) has been attached. It is done automatically by the device.

1.2 Suitable for bonding of FOG, FOB, OGS products.

Technical Parameters

Product qualification rate: ≥98%

Process flow:

1) Manually place the Panel on the Panel workbench

2) Press the vacuum button of the Panel workbench, and the Panel is adsorbed on the Panel workbench

3) Place the FPC to be hot-pressed on the FPC workbench, and initially position it with the Panel and vacuum adsorption.

4) The operator looks at the display on the MONITOR to perform alignment work.

5) The operator presses the start button with both hands, and the indenter presses down. Complete pre-compression The device moves to the next position and repeats 3) and 4) until all pre-compression positions are completed.

6) After the pre-compression is completed, the platform automatically moves to the current pressure position, and the current pressure head drops. After the current pressure time is up, the current pressure head rises and the hot pressing of a product ends. ,

7) Manually remove the hot-pressed Module and repeat 1)~7) to produce the next product.

9) The PCB and FPC operations are the same.

Pressing accuracy: PCB: X: ±10um Y: ±10um OLB:X: ±5um Y: ±5um

15.6寸单边多段FOB / FOB

设备简述

1．1 本设备为半自动热压机，是在已贴附好导电膜（ACF）的 Panel 上为连接 FPC而进行对位 Bonding 的设备，Panel和FPC 的取放、对位是手工完成，Bonding是设备自动完成。
1．2 适合于FOG,FOB,OGS产品Bonding。

设备用途

技术参数

产品合格率:≥98％

工艺流程:

1）手动将 Panel 放在 Panel 工作台上

2）按下 Panel 工作台的真空按钮，Panel 吸附在 Panel 工作台上

3）将待热压的 FPC放在 FPC 工作台上，并与 Panel 初步定位且真空吸附。

4）作业者看着 MONITOR 上的显示进行对位工作。

5）作业者双手按下启动按钮,压头下压。完成预压设备移动到下一位，重复3）和4），直到所有预压位完成。

6) 完成预压后，平台自动移动到本压位，并且本压头下降，本压时间到后，本压头上升，一个产品的热压结束。，

7）手动取下热压好的 Module，重复1）~7）生产下一产品 9）PCB與FPC操作相同.

压合精度:PCB: X：±10um Y:±10um OLB:X: ±5um Y:±5um

设备特点

工作视频：