15.6Inch single side multi-segment FOB / FOB constant temperature bonding machine OL-F156
15.6Inch single side multi-segment FOB / FOB constant temperature bonding machine OL-F156
- 型号: OL-F156
- 型号:
15.6Inch single side multi-segment FOB / FOB constant temperature bonding machine OL-F156
1.1 This equipment is a semi-automatic hot press bonding machine. It is a device for bonding the FPC to the Panel on which the conductive film (ACF) has been attached. It is done automatically by the device.
1.2 Suitable for bonding of FOG, FOB, OGS products.
Technical Parameters
Product qualification rate: ≥98%
Process flow:
1) Manually place the Panel on the Panel workbench
2) Press the vacuum button of the Panel workbench, and the Panel is adsorbed on the Panel workbench
3) Place the FPC to be hot-pressed on the FPC workbench, and initially position it with the Panel and vacuum adsorption.
4) The operator looks at the display on the MONITOR to perform alignment work.
5) The operator presses the start button with both hands, and the indenter presses down. Complete pre-compression The device moves to the next position and repeats 3) and 4) until all pre-compression positions are completed.
6) After the pre-compression is completed, the platform automatically moves to the current pressure position, and the current pressure head drops. After the current pressure time is up, the current pressure head rises and the hot pressing of a product ends. ,
7) Manually remove the hot-pressed Module and repeat 1)~7) to produce the next product.
9) The PCB and FPC operations are the same.
Pressing accuracy: PCB: X: ±10um Y: ±10um OLB:X: ±5um Y: ±5um
工作视频: