Double heads pulse heating TV repairing COF bonding machine for 85inch OL-FP85T
85inch up and down alignment CCD pulse heating COF bonding machine TV Repairing machine
- 型号:
- 型号: OL-FP85T
85inch up and down alignment CCD pulse heating COF bonding machine TV Repairing machine
This equipment is a manual bonding machine,. It is a device for bonding the FPC/COF to the Panel that has been attached to the conductive film (ACF). The picking, placing and alignment of the Panel is done manually, and the bonding is the automatic device. carry out. Suitable for panel hot pressing from 13" to 100".
Technical Parameters
Features
1. The high-precision imaging unit is used to increase the times of magnifications to nearly 150 times;
2. Add manual room temperature pre-bonding function to solve the problem of COF bending;
3. The upper and down light sources are used for the alignment at the same time to make the alignment process more clear.
4. It adopts pulse heating method, which is suitable for various products.
5. PLC control action and high-precision temperature control module control temperature to improve the stability of the whole machine.
6. Enlarge the platform to 100 inches.
7. Change the fixed platform to a platform that can move left and right (manually move) to reduce the number of times of handling the liquid crystal glass.
8. A retractable support mechanism is installed at the tail of the platform, and the retractable support mechanism is extended to fix the liquid crystal glass when the G-L of the product is produced.
9. Add a block structure on the surface of the platform to prevent the liquid crystal glass and the platform from generating a vacuum, so that the glass can be easily taken and placed when large-size liquid crystal glass is produced.
10. The flatness of the platform can be adjusted. The flatness adjustment mechanism has been added to the bottom of the platform.
11. The left and right bonding head press OLB and PCB respectively, reducing the steps of changing the size of the bonding head and modifying the parameters.
本设备为手动热压机,是在已贴附好导电膜(ACF)的 Panel 上为连接 FPC/COF而进行对位 Bonding 的设备,Panel 的取放、对位是手工完成,Bonding 是设备自动完成。适合于 13"~100"的 Panel 热压.
工作视频