85inch pulse heating COF bonding machine TV Repairing machine

Double heads pulse heating TV repairing COF bonding machine for 85inch OL-FP85T

This equipment is a manual bonding machine,. It is a device for bonding the FPC/COF to the Panel that has been attached to the conductive film (ACF). The picking, placing and alignment of the Panel is done manually, and the bonding is the automatic device. carry out. Suitable for panel hot pressing from 13" to 100".

Technical Parameters

Features

1. The high-precision imaging unit is used to increase the times of magnifications to nearly 150 times;

2. Add manual room temperature pre-bonding function to solve the problem of COF bending;

3. The upper and down light sources are used for the alignment at the same time to make the alignment process more clear.

4. It adopts pulse heating method, which is suitable for various products.

5. PLC control action and high-precision temperature control module control temperature to improve the stability of the whole machine.

6. Enlarge the platform to 100 inches.

7. Change the fixed platform to a platform that can move left and right (manually move) to reduce the number of times of handling the liquid crystal glass.

8. A retractable support mechanism is installed at the tail of the platform, and the retractable support mechanism is extended to fix the liquid crystal glass when the G-L of the product is produced.

9. Add a block structure on the surface of the platform to prevent the liquid crystal glass and the platform from generating a vacuum, so that the glass can be easily taken and placed when large-size liquid crystal glass is produced.

10. The flatness of the platform can be adjusted. The flatness adjustment mechanism has been added to the bottom of the platform.

11. The left and right bonding head press OLB and PCB respectively, reducing the steps of changing the size of the bonding head and modifying the parameters.

85寸双头上下对位脉冲热压机

设备简述

本设备为手动热压机，是在已贴附好导电膜（ACF）的 Panel 上为连接 FPC/COF而进行对位 Bonding 的设备，Panel 的取放、对位是手工完成，Bonding 是设备自动完成。适合于 13"～100"的 Panel 热压.

设备用途

技术参数

设备特点

1、采用高精度的成像单元，将放大位数提高到近150倍；

2、增加手动常温预压功能，解决COF弯曲问题；

3、采用上下光源同时用于对位让对位过程清晰度更高。

4、采用脉冲加热方式，适用于各种产品。

5、PLC控制动作加高精度温控模块控制温度，提高整机的稳定性。

6、将平台加大到100寸。

7、将固定的平台改为左右可以移动的平台（手动移动），减少拿放液晶玻璃的次数。

8、平台尾部加装可伸缩的支撑机构，当生产产品的G-L时伸缩的支撑机构伸出用于固定液晶玻璃。

9、平台面上加垫块结构，让液晶玻璃与平台间不会产生真空，让生产大尺寸液晶玻璃时能方便地取放玻璃。

10、平台平整度可调节系统，在平台最底层曾加平整度调节机构。

11、左右压头分别压OLB和PCB，减少更换压头大小和修改参数的步骤。

工作视频