COF/COG/COP pre-bonding machine OL-COF003

This equipment is a semi-automatic pre-bonding machine. It is a device that pre-bonding IC or COF on the Panel that has been attached to the conductive film (ACF). The pick and place of the Panel is completed manually, and the pre-alignment is automatically completed by the equipment.

  • 型号:
  • 型号: OL-COF003

COF/COG/COP pre-bonding machine OL-COF003


Machine Specification (Model Number:OL-COF003):

1. Machine function:

1.1 This equipment is a semi-automatic pre-bonding machine. It is a device that pre-bonding IC or COF on the Panel that has been attached to the conductive film (ACF). The pick and place of the Panel is completed manually, and the pre-alignment is automatically completed by the equipment.

Suitable for 2"7" Panel.

2.Machine structure:

2.1 Equipment unit:

1)Machine Frame. 1

2)Bonding head system: pre-bonding 1SETS.

3)Anti-falling device for bonding head:1SET

4)Feeding unit: IC feeding: IC box specifications are 2 inches, 3 inches, and 4 inches;

             COF feeding: universal feeding unit for all specifications

             IC loading and COF loading each one set with machine.

5)CCD unit: X.Y.Z sliding table. Can be installed under the Panel platform.

   6)Panel/PCB platform movable: X.Y.θ.Z direction movement positioning,

    Z direction is manually adjusted

7)Device operation interface: HMI Touch screen 1SET

2.2 Work platform:

1)Panel size: Min: 2.0 inch  Max: 7.0 inch

2)IC SIZE: MaxL*W:38*3 mm  MinL*W:5*0.5 mm

3)FPC/COF size : MaxL*W:65*45 mm  MinL*W:20*10 mm

3:Unit Description

3.1 Machine performance:

1)Equipment capacity (C/T: cycle time): IC: about 550PCS/H  COF: about 300PCS/H

2)Rate of qualified products:≥98%.

3.2 Process parameter control

1)Parameter setting: setting on the HMI, for example: hot pressing time/motor speed, etc.

2)Touch screen password lock: have password function.

3.3 Special requirements:

3.3.1 Process flow:

3.3.1.1  IC PART:

1) Open the machine, place the IC tray in advance and start the equipment;

2) The IC tray automatically moves to the adsorption position, the bonding head automatically corrects the IC after it is adsorbed, and then drops to the CCD camera IC mark position. After the photo is completed, the bonding head returns to the standby position;

3) The operator puts the Panel into the positioning position. Start the vacuum button. The Panel platform automatically moves to the glass mark position, and the equipment automatically performs alignment work;

4) After the alignment is completed, the equipment automatically do the pre-bonding.

5) After the pre-bonding time is over, the pre-bonding head rises and the platform exits to the loading position;

6) The operator takes out the pre-bonded glass;

7) Repeat 2)~6) to produce the next product

3.3.1.2 COF PART

   1) Open the machine , place the COF in advance and start the equipment;

   2) The COF feeding mechanism moves to the adsorption position, the bonding head adsorbs COF, the COF feeding mechanism exits, the pre-bonding head drops to the CCD camera position, and the bonding head returns to standby position (if it is a flexible screen, then rise to the standby position, and the IC disk to the flexible screen Photo position);.

   3) The operator puts the Panel into the positioning position. Start the vacuum button and the Panel platform automatically arrives the glass mark position, the equipment automatically performs alignment work;

   4) After the alignment is completed, the equipment will automatically do the pre-bonding,

 if it is a flexible screen, you can choose directly to do pre-bonding after taking pictures or do the pre-bonding after confirmation.

   5) After the pre-bonding time is over, the pre-bonding head rises and the platform exits to the loading position;

   6) The operator takes out the pre-bonded glass and puts COF on the COF feeding mechanism at the same time;

   7) Repeat 2)~6) to produce the next product

3.3.2 Features:

1) Parameters (such as: hot pressing time/cleaning time/roll silicone length/silicone

Scroll frequency, etc.) can be set on the touch screen and displayed on the touch screen

2) The directory of the alarm system can be displayed on the touch screen and can be cleared

3.3.3 Pitch Suitable for PITCH :18-25um

3.3.4 Bonding accuracy  IC:X:≦0.003mm Y:≦0.003 mm

                      COFX:≦0.004mm Y:≦0.005 mm

3.3.5 Panel&COF One person is loading and unloading at the same position

3.3.6 Product changeover

1) Universal template, made of anti-static and anti-scratch materials

2) When replacing a new product, the adjustment time is about 15-30min

4.Electrical requirements:

4.1 Control System: PLC: Panasonic, for program modification

4.2 Solenoid valve : SMCCKD

4.3 Pressure regulating valve combination: SMC

4.4 Power switch button: Izumi  Fuji

4.5 Cylinder: SMC,   Screw:THK   Guide: THK

4.6 Motor: Panasonic

4.7 Buzzer: Have. The machine has any errors or needs to be mentioned, When the operator wakes up, the buzzer alarm works

4.8 Circuit protection

1) Misoperation, the machine does not move

2) The machine does not operate after power failure

4.9 Anti-static plug grounding requirements: Need

4.10 Trachea/wire and other signs

1) Wire number identification at both ends of the wire

2) There are signs on both ends of the trachea

3) Complete identification of electrical accessories

4.11 Security:

1) On the right side of the operator standing side, there is an emergency stop button

5 Machine architecture details:

5.1 Dimensions:

1) Machine width: about 830+210mm (COF feeding mechanism)

2) Machine depth: about 760mm

3) Machine height: about 1340mm

4) Operating height: 800±10mm

5.2 Machine weight: About320kg

5.3 Machine color: The surface of the frame is sprayed with oil, the color is Corrugated light yellow palladium, other parts are chrome plated or oxidized

5.4Equipment delivery status: The surface of the equipment is clean and dust-free. Place warning signs where there is danger.

5.5 Machine requirements the work environment : Clean, dust-free, clean room

5.6 Bonding head unit :

1) Number of bonding head: 1 pre-bonding head, driven up and down by the servo motor and  

                        SMC cylinder;

2) Heating method: constant temperature,RT~150℃, ± 3℃

3) The pressure adjustment method of the hot head: adjust with SMC precision pressure regulator

4) Preset pressure accuracy: 0.01MPa, 0.01kgf/cm², 0.01bar, 0.1psi

5) Pressure display: Digital display. unit: MPa, kgf/cm²,bar,psi optional

6) Hot head output: 15120N,

7)Bonding head size: IC: Pre-bonding head: L22*W2 (customizable)

                    COF: customized

8) Thermocouple model: K Type

9) Bonding time setting: 0.1 ~ 99.0Sec

10) Material of bonding head: SU440C

11) Adjustment method of indenter parallelism: adopt jacking adjustment,

  Stable and high sensitivity.

5.7 Backup section

IC: Material high-quality carbon steel

COF: Quartz

5.8 CCD Image unit :

   1) Two CCDs are aligned, installed at the bottom of the platform

   2) CCD Camera 1/3 B/W

   3) Magnification: X6   Center distance: 520mm

   5) Light source system: LED,

   6) Monitor:10.4"TFT screen 1

   7) CCD adjustment range: X: 20mm, Y: 10mm, Z: 10mm

5.9 Panel platform unit :

1) Single station, platform with servo motor + rail drive;

2) Platform drive: Panasonic motor, THK or Kuroda screw guide;

3) Diameter of platform vacuum hole: 1.2

4) Z direction adjustment distance (differential head adjustment): -2.02.0 mm

5) Universal template design for the platform, positioning block can be re-positioned after

  changing the Panel.

6) Flatness of template: 0.005 mm

5.10 FPC platform unit:NONE

6 Energy requirements:

6.1 power supply

1) 1Phase AC220V/50Hz/1200W

2) The power cord and compressed air line are in the lower side of the back of the machine

Part of the opening (the diameter of the hole 40~ 50mm) is drawn out, 1.5m cable.

6.2 Compressed air

1) Tracheal color: transparent

2) Tracheal diameter: 8mm

3) Working air pressure: 0.4~0.7MPa

4) Air consumption: ≈150L/min

6.3 Vacuum

1) Vacuum control method: vacuum button

2) Vacuum consumption: ≈36L/min

3) Color of vacuum tube: yellow

7 PACKING:

7.1 Wooden carton size: 115*86*155CM

7.2 Weight: About 400kg


设备简述

本设备满足高精度IC TO STN-LCD、COLOR STN-LCD、TFT-LCD、OLED-LCD及柔性OLED的全自动对位及预压,主要用于IC返修及小批量生产。

设备用途

本设备满足高精度IC TO STN-LCD、COLOR STN-LCD、TFT-LCD、OLED-LCD及柔性OLED的全自动对位及预压,主要用于IC返修及小批量生产。

技术参数


    适用LCD尺寸:

    为2~7寸之STN/CSTN/TFT-LCD(平台可扩至9寸);

    产能:

    约600颗IC/小时;

    Panel厚度:

    0.3~1.1mm;

    IC压合范围:

    MIN:8*0.6mm,MAX40*5mm;

    实装精度:

    ±0.003mm

    预压头规格:

    20*2mm,可根据客户要求改变;

    热压头平整度 :

    ±5μm;

    加热方式:

    恒温控制;

    温度范围:

    RT-200℃;

    温度精度:

    ±3℃;

    产品固定方式:

    真空吸附;

    耗气量:

    0.2立方/分钟;

    工作气压:

    0.4~0.6Mpa;

    电源:

    220V,50HZ,1000W;

    总重:

    350Kg;

    外形尺寸:

    L800*W840*H1310(720)

设备特点

1、采用高粒度的视觉控制系统及定位系统(松下及FAST等可选择);

2、采用更加人性化的界面设计,让学习人员更容易上手;

3、采用模块化设计及品种功能,太太缩短产品切换时间及新产品调试时间。


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